- Course Number:
- MT 100
- Course Title:
- Introduction to Microelectronics and Nano Technology
- Credit Hours:
- Lecture Hours:
- Lecture/Lab Hours:
- Lab Hours:
- Special Fee:
Course DescriptionIntroduces the methods used to manufacture Micro and Nano technologies. Traces semiconductor processing from raw material to a finished integrated circuit using planar technology. Introduces the processes and equipment used to create devices on the micro and nano scale. Emerging applications of MEMS and Nanotechnology are discussed. Prerequisites: MTH 65. Audit available.
Addendum to Course Description
Traces semiconductor processing from raw material to a finished integrated circuit. Includes the following manufacturing processes: crystal growing and wafer preparation, oxidation, photolithography, etch, deposition, doping, metallization, and test/sort. Prerequisite: MTH 65.
This course may be offered in an on-campus format or in a distance learning format on the world-wide-web.
Intended Outcomes for the course
Determine if this is a career and degree you wan to pursue.
Develop basic learning skills to help you succeed in the PCC MT AAS program
Understand basic construction and operation of semiconductor devices, and the processes used in microelectronics manufacturing.
Understand emerging uses and opportunities with MEMS and Nanotechnology
Understand the working environment: cleanrooms, compressed workweek, etc.
Develop abilities and habits in using the information methods of the industry to communicate and find information on: business news, processes, advances, technical data, etc.
Course Activities and Design
Course activities will include a variety of learning activities. The lecture portion of the course, three hours per week, will include instructor delivered lectures, demonstrations, and/or student discussions stressing key topics in the course. In preparation for the lecture portion of the course, students will be expected to complete all reading and problem/question homework assignments.
Outcome Assessment Strategies
Assessment of student performance in this course will consist of written examinations. Assessment may also include oral presentations, written reports, and other class projects.
Course Content (Themes, Concepts, Issues and Skills)
1. Microelectronics Technology
1.1. Understand the courses and their purpose in the MT AS degree program
1.2. Identify the local employment opportunities in the industry
1.3. Describe the working environment in the industry
2. History of the Semiconductor Industry
2.1. Trace the history of the semiconductor industry from the invention of the transistor in 1947 to the present, giving dates and names of people for major discoveries, inventions, and events.
2.2. Identify key applications of integrated circuits and list the advantages of integrated circuits over earlier, discrete devices used in electronic products.
2.3. State Moores Law and discuss current trends in semiconductor manufacturing: understand feature size and feature size reduction, role of wafer size and benefits of increasing wafer size, associated fab construction costs, the role of throughput, and associated economic risks.
3. Semiconductor Materials
3.1. Identify the parts of an atom. Provide sketches to describe the atomic structure of a given atom (e.g. carbon, silicon, and germanium).
3.2. Describe an atom, ion, and molecule. Use sketches as appropriate.
3.3. List three semiconducting materials.
3.4. Name the two unique properties of a doped semiconductor: precise resistivity control through doping and electron and hole conduction.
3.5. Describe the difference in composition and electrical functioning of n-type and p-type semiconductor materials.
3.6. Describe the mechanism for conduction in n-type and p-type semiconductor materials.
4. Crystal Growth and Wafer Preparation
4.1. Define the following terms: crystalline, polycrystalline, and amorphous.
4.2. Define the terms: Miller index and crystal plane.
4.3. Describe the Czochralski method of growing crystals.
4.4. Describe the steps required to produce a silicon wafer from a silicon ingot.
4.5. Describe the steps required to produce a silicon ingot from sand.
5. Overview of Wafer Fabrication
5.1. Draw a cross-sectional view of a MOS transistor and label the source, drain, gate, and gate oxide.
5.2. Describe the basic on/off switching operation of a MOS transistor.
5.3. Describe the sequential processes (i.e. the process flow) used in manufacturing a MOS transistor.
5.4. Define the terms: layering, patterning, and doping.
5.5. Describe how a fab is laid out including facilities and contamination control devices and procedures
5.6. Describe the role of test and sort, the relationship of yield and defect density, and the purpose of in-line metrology and statistical process control
5.7. Describe the purpose of packaging, the different options, and the economics.
6.1. Write the chemical reaction used to produce silicon dioxide in the semiconductor manufacturing process.
6.2. Describe the mechanism of thermal oxidation.
6.3. List three principal uses of silicon dioxide layers in semiconductor devices: (1) surface passivation, (2) surface dielectric, and (3) device dielectric.
6.4. Describe the basic equipment layout and components used for oxidation
7.1. Define photolithography in the context of semiconductor manufacturing.
7.2. Define the terms: negative photoresist and positive photoresist.
7.3. Explain the difference between light field and dark field masks (reticles).
7.4. Construct a flow diagram (about ten steps) that represents the photolithography process. Give reasons for each step and show a cross-sectional view of the wafer at each step.
7.5. Describe the basic equipment layout and components used for photolithography
8.1. Define etch and explain its use in semiconductor manufacturing.
8.2. Explain what is meant by anisotropic etch and isotropic etch.
8.3. Describe the plasma etching process.
8.4. Compare and contrast wet etch with dry etch.
8.5. Describe processes used to remove the photoresist layer.
8.6. Describe the basic equipment layout and components used for etching
9.1. Name the chemical elements used for doping n-type and p-type semiconductor materials.
9.2. Describe the process of diffusion. List two major conditions that are necessary for diffusion to take place.
9.3. Explain the drive-in process and its purpose in diffusion.
9.4. List the key limits of diffusion in the doping of semiconductors and show how these limits are overcome by ion implanting.
9.5. List the key subsystems of an ion implanter.
9.6. Explain what is meant by projected range and concentration profile with relevance to ion implanting.
9.7. Describe the basic equipment layout and components of a rapid thermal processor
10. Chemical Vapor Deposition
10.1. List at least five desirable attributes of deposited films and describe why are they important in the manufacture of semiconductor devices.
10.2. Name the main parts of a CVD system. Use sketches as necessary.
10.3. Explain the basic principles of CVD and discuss the related chemical considerations.
10.4. Give the major similarities and differences in methods, deposited films, and equipment for APCVD, LPCVD, and PECVD systems.
10.5. Give a brief overview of processes, including chemistry and equipment, used to provide polysilicon semiconductor layers, insulators (dielectrics), and conductors in microelectronic devices.
11.1. Define metallization in semiconductor manufacturing and give examples of functions provided by metal films.
11.2. List desirable properties of metals used as surface conductors on an integrated circuit.
11.3. List some key metals and alloys used in the metallization processes in semiconductor manufacturing.
11.4. Describe the sputter deposition or physical vapor deposition process.
11.5. Describe the electroplating process.
12. Test, Sort, and Packaging
12.1. Describe the process of testing and sorting die on a wafer.
12.2. Explain reliability and how reliability testing is done.
12.3. Describe the parametric tests performed on a die.
12.4. List the four functions of a semiconductor package.
12.5. Recognize and identify the major package designs, e.g. Dual-in-Line, Quad, and Pin Grid Array.