Course Content and Outcome Guide for MT 050
- Posted by:
- Eric Kirchner
- Course Number:
- MT 050
- Course Title:
- Soldering Practice
- Credit Hours:
- Lecture hours:
- Lecture/Lab hours:
- Lab hours:
- Special Fee:
Course DescriptionManual soldering is an important skill for technicians, especially repair and rework. This hands-on class provides an overview of the tools and components used for soldering, explores the importance of soldering to the semiconductor industry, and covers procedures for soldering preparation, through-hole and Surface Mount techniques, soldering safety and cleanup. Comprehension of the technical information presented is verified through inspection examinations. Non-lead solders and no clean liquid Fluxes will be used in the course.
Addendum to Course Description
This course is normally run as part of the Entry Level High Tech Skills Training (ELHTST) Program for individuals who speak English as a Second Language. This is a competitive entry program with good prospects for job placement. For more information go to: www.workforceallianceonline.org/capcenter
If there is sufficient interest this course can be run by request. Contact the Microelectronics department: email@example.com
Course Activities and Design
This course will focus on laboratory activities. Concepts will be introduced in the laboratory, then practiced and demonstrated by the students. The course may include some reading and homework assignments which the students are expected to complete.
The normal format for the course is five lecture/lab sessions lasting four hours, meeting all in one week.
Outcome Assessment Strategies
Assessment is based on performance of specific soldering tasks and techniques. Student work must meet certain quality standards to pass the course. The book “Acceptability of Electronic Assemblies” by IPC will be the standard used. Copies will be available in class.
This course is only offered with the P/NP grading option.
Course Content (Themes, Concepts, Issues and Skills)
1. Understand Safety as it relates to soldering
2. Remove damaged components on thru hole boards
3. Install components on thru hole boards
4. Repairs wire connections
5. Form Leads
6. Apply Flux properly, when necessary.
7. Remove damaged Surface Mount Devices
8. Install Surface Mount Devices
9. Understand the needs of Cleanup with new solder connections
10. The difference between Lead based solders and non-lead solders
11. Safely working around very hot objects
12. Solder removing methods and practice
13. Building circuits on thru hole boards, removing and reinstalling them without damaging the boards
14. Putting components on SMT boards. Removing and reinstalling these devices without damaging the boards.
15. Soldering multiple pinout devices
16. Perform touch-up tasks